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  • Wednesday, Apr 29th
    1:45 PM - 3:10 PM EDT
    Session 1: Packaging Leadership Session – Vision for the Future of Advanced Manufacturing
    Location: Renaissance Ballroom
    Smart Manufacturing
  • Wednesday, Apr 29th
    3:20 PM - 4:50 PM EDT
    Session 2: Modular Chiplet Architectures: Using AI & Metrology to improve Yield & cost in High Volume Manufacturing
    Location: Renaissance Ballroom
    Smart Manufacturing
  • Thursday, Apr 30th
    10:00 AM - 11:15 AM EDT
    Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control
    Location: Renaissance Ballroom
    Smart Manufacturing
  • Thursday, Apr 30th
    11:15 AM - 12:40 PM EDT
    Session 4: Securing the Advanced Packaging Supply Chain: Re-shoring, Traceability and Inventory Integrity
    Location: Renaissance Ballroom
    Smart Manufacturing